Clock skew reduction for stacked chips using multiple source buffers. - Nanako Niioka; Masashi Imai; Masa-Aki Fukase; Yuuki Miura; Kaoru Furumi; Atsushi Kurokawa (ISCIT, 2015)

Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs. - Kaoru Furumi; Masashi Imai; Atsushi Kurokawa (ISQED, 2017)