Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC. - Ladislav Andricek; Michael Beimforde; Armin Klumpp; Anna Macchiolo; Karl-Reinhard Merkel; Hans-Günther Moser; Richard Nisius; Rainer Helmut Richter; Josef Weber; Philipp Weigell; Robert Wieland (3DIC, 2010)

Silicon-interposer with high density Cu-filled TSVs. - Robert Wieland; Kai Zoschke; Nils Jurgensen; Karl-Reinhard Merkel; Lars Nebrich; Jürgen Wolf (3DIC, 2010)

3D TSV based high frequency components for RF IC and RF MEMS applications. - Montserrat Fernandez-Bolaños; Wolfgang A. Vitale; Mariazel Maqueda Lopez; Adrian M. Ionescu; Armin Klumpp; Karl-Reinhard Merkel; Josef Weber; Peter Ramm; Ilja Ocket; Walter De Raedt; Amin Enayati (3DIC, 2016)