Influence of gate length on ESD-performance for deep submicron CMOS technology. - Karlheinz Bock; Bart Keppens; Vincent De Heyn; Guido Groeseneken; L. Y. Ching; A. Naem (Microelectron. Reliab., 2001)

Polymer Electronics Systems - Polytronics. - Karlheinz Bock (Proc. IEEE, 2005)

Investigations of the influence of dicing techniques on the strength properties of thin silicon. - Stephan Schoenfelder; Matthias Ebert; Christof Landesberger; Karlheinz Bock; Jörg Bagdahn (Microelectron. Reliab., 2007)

Polytronik und das Internet der Dinge. - Karlheinz Bock (Internet der Dinge, 2007)

Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags. - Indranil Bose; Kornelius Tetzner; Kathrin Borner; Karlheinz Bock (Microelectron. Reliab., 2014)

pH measurements of FET-based (bio)chemical sensors using portable measurement system. - Tetiana Voitsekhivska; Felix Zorgiebel; Eike Suthau; Klaus-Jürgen Wolter; Karlheinz Bock; Gianaurelio Cuniberti (EMBC, 2015)

Energy-Efficient Transceivers for Ultra-Highspeed Computer Board-to-Board Communication. - Michael Jenning; Bernhard Klein; Ronny Hahnel; Dirk Plettemeier; David Fritsche; Gregor Tretter; Corrado Carta; Frank Ellinger; Tobias Nardmann; Michael Schröter; Krzysztof Nieweglowski; Karlheinz Bock; et al. (ICUWB, 2015)

Design considerations and constraints in silicon based optical on-board interconnects for short range communications. - Mircea Catuneanu; Ronny Henker; R. Hosseini; M. Jazayerifar; H. Aminpour; David Schoeniger; Alexandru Giuglea; Krzysztof Nieweglowski; Frank Ellinger; Karlheinz Bock; Kambiz Jamshidi (ICTON, 2017)

A CP Model for a Scheduling Problem with Limited secondary Resources compared to a des Model. - Dirk Doleschal; Karlheinz Bock (WSC, 2018)

A Comparison of an CP and MIP Approach for Scheduling jobs in production areas with Time Constraints and uncertainties. - Christian Maleck; Gottfried Nieke; Karlheinz Bock; Detlef Pabst; Marcel Stehli (WSC, 2018)

A Mathematical Model for the External Scheduling of a Cluster Tool Workstation. - Gottfried Nieke; Christian Maleck; Karlheinz Bock; Marcel Stehli; Steffen Kalisch (WSC, 2018)

Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly. - Karsten M. Decker; René M. Rehmann; Mike Roellig; Karlheinz Bock (Microelectron. Reliab., 2018)

Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems. - Krzysztof Nieweglowski; Lukas Lorenz; Sebastian Lüngen; Tobias Tiedje; Klaus-Jürgen Wolter; Karlheinz Bock (Microelectron. Reliab., 2018)

Architecture and Advanced Electronics Pathways Toward Highly Adaptive Energy- Efficient Computing. - Gerhard P. Fettweis; Meik Dorpinghaus; Jerónimo Castrillón; Akash Kumar 001; Christel Baier; Karlheinz Bock; Frank Ellinger; Andreas Fery; Frank H. P. Fitzek; Hermann Härtig; Kambiz Jamshidi; Thomas Kissinger; et al. (Proc. IEEE, 2019)

Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. - Viktor Dudash; Kashi Vishwanath Machani; Bjoern Boehme; Simone Capecchi; Jungtae Ok; Karsten Meier; Frank Kuechenmeister; Marcel Wieland; Karlheinz Bock (IRPS, 2023)

X-MAPE: Extending 6G-Connected Self-Adaptive Systems with Reflexive Actions. - Marco Liess; Julian Demicoli; Tobias Tiedje; Matthias Lohrmann; Matthias Nickel; M. Luniak; Dimitrios A. Prousalis; Thomas Wild; Ronald Tetzlaff; Diana Göhringer; Christian Mayr 001; Karlheinz Bock; et al. (NFV-SDN, 2023)

Compensation of thermal drifts on MEMS Inertial Measurement Unit using package underfilling. - Gabriele Patrizi; Marco Carratù; Karsten Meier; Paolo Sommella; Antonio Pietrosanto; Karlheinz Bock; Lorenzo Ciani (I2MTC, 2025)