Experimental determination of the Young's modulus of copper and solder materials for electronic packaging. - Frank Kraemer; Mike Roellig; René Metasch; Joseph Al Ahmar; Karsten Meier; Steffen Wiese (Microelectron. Reliab., 2018)

Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor. - Simon Schlipf; André Clausner; Jens Paul; Simone Capecchi; Laura Wambera; Karsten Meier; Ehrenfried Zschech (IRPS, 2020)

Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. - Viktor Dudash; Kashi Vishwanath Machani; Bjoern Boehme; Simone Capecchi; Jungtae Ok; Karsten Meier; Frank Kuechenmeister; Marcel Wieland; Karlheinz Bock (IRPS, 2023)

Compensation of thermal drifts on MEMS Inertial Measurement Unit using package underfilling. - Gabriele Patrizi; Marco Carratù; Karsten Meier; Paolo Sommella; Antonio Pietrosanto; Karlheinz Bock; Lorenzo Ciani (I2MTC, 2025)