Mechanical reliability assessment of 28nm Back End of Line (BEoL) stack using finite element analysis and validation. - Kashi Vishwanath Machani; Holm Geisler; Dirk Breuer; Frank Kuechenmeister; Jens Paul (IRPS, 2015)

Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. - Viktor Dudash; Kashi Vishwanath Machani; Bjoern Boehme; Simone Capecchi; Jungtae Ok; Karsten Meier; Frank Kuechenmeister; Marcel Wieland; Karlheinz Bock (IRPS, 2023)