Kaspar M. B. Jansen

Orcid: 0000-0002-2172-9824

Affiliations:
  • TU Delft, The Netherlands


According to our database1, Kaspar M. B. Jansen authored at least 29 papers between 2007 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Mimosa: Modular Self-folding Hinges Kit for Creating Shape-changing Objects.
Proceedings of the Eighteenth International Conference on Tangible, 2024

2023
BreatheWithMe: Exploring Visual and Vibrotactile Displays for Social Breath Awareness during Colocated, Collaborative Tasks.
Proceedings of the Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems, 2023

2022
An End-to-End Deep Learning Pipeline for Football Activity Recognition Based on Wearable Acceleration Sensors.
Sensors, 2022

Development of Low Hysteresis, Linear Weft-Knitted Strain Sensors for Smart Textile Applications.
Sensors, 2022

2021
Things that help out: designing smart wearables as partners in stress management.
AI Soc., 2021

Development of hysteresis-free and linear knitted strain sensors for smart textile applications.
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021

2020
Performance Evaluation of Knitted and Stitched Textile Strain Sensors.
Sensors, 2020

A novel sweat rate and conductivity sensor patch made with low-cost fabrication techniques.
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020

Development of a microfluidic collection system to measure electrolyte variations in sweat during exercise.
Proceedings of the 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2020

ThermalWear: Exploring Wearable On-chest Thermal Displays to Augment Voice Messages with Affect.
Proceedings of the CHI '20: CHI Conference on Human Factors in Computing Systems, 2020

2019
How to shape the future of smart clothing.
Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers, 2019

2018
Disposable, stretchable on-skin sensors for posture monitoring.
Proceedings of the 4th ACM Workshop on Wearable Systems and Applications, 2018

2017
Understanding Autonomy, Animism and Presence as a Design Strategy for Behavior Change.
Proceedings of the Companion Publication of the 2017 ACM Conference Companion Publication on Designing Interactive Systems, 2017

2016
Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging.
Microelectron. Reliab., 2016

Functional Demonstrators to Support Understanding of Smart Materials.
Proceedings of the TEI '16: Tenth International Conference on Tangible, 2016

2014
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products.
Microelectron. Reliab., 2014

2012
Characterization of the viscoelastic properties of an epoxy molding compound during cure.
Microelectron. Reliab., 2012

2010
Prediction of cure induced warpage of micro-electronic products.
Microelectron. Reliab., 2010

A fast moisture sensitivity level qualification method.
Microelectron. Reliab., 2010

2009
Fast reliability qualification of SiP products.
Microelectron. Reliab., 2009

Modeling and characterization of molding compound properties during cure.
Microelectron. Reliab., 2009

2007
Numerical modeling of warpage induced in QFN array molding process.
Microelectron. Reliab., 2007

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
Microelectron. Reliab., 2007

Measuring the through-plane elastic modulus of thin polymer films in situ.
Microelectron. Reliab., 2007

Characterization of moisture properties of polymers for IC packaging.
Microelectron. Reliab., 2007

Novel shear tools for viscoelastic characterization of packaging polymers.
Microelectron. Reliab., 2007

Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques.
Microelectron. Reliab., 2007

Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach.
Microelectron. Reliab., 2007

Correlation between chemistry of polymer building blocks and microelectronics reliability.
Microelectron. Reliab., 2007


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