A 0.296pJ/bit 17.9Tb/s/mm2 Die-to-Die Link in 5nm/6nm FinFET on a 9μm-Pitch 3D Package Achieving 10.24Tb/s Bandwidth at 16Gb/s PAM-4. - Mu-Shan Lin; Chien-Chun Tsai; Shenggao Li; Tze-Chiang Huang; Wen-Hung Huang; Kate Huang; Yu-Chi Chen; Alex Liu; Yu-Jie Huang; Jimmy Wang; Shu-Chun Yang; Nai-Chen Cheng 001; et al. (VLSI Technology and Circuits, 2024)