Glass Interposer for High-Density Photonic Packaging. - Lars Brusberg; Jason R. Grenier; Sükrü Ekin Kocabas; Aramais R. Zakharian; Lucas W. Yeary; Daniel W. Levesque; Barry J. Paddock; Robert A. Bellman; Robin M. Force; Chad C. Terwilliger; Clifford G. Sutton; Jeffrey S. Clark; et al. (OFC, 2022)

High-density Evanescent Chip Coupling with Detachable Fiber Connector for Co-packaged Optics. - Lars Brusberg; Jorge A. Holguin-Lerma; Janderson R. Rodrigues; Betsy J. Johnson; Jason R. Grenier; Marissa Granados-Baez; Robin M. Force; Aramais R. Zakharian; Chad C. Terwilliger; Katerina Rousseva (OFC, 2025)