A flexible and stretchable tactile sensor utilizing static electricity. - Yasunori Tada; Masahiro Inoue; Toshimi Kawasaki; Yasushi Kawahito; Hiroshi Ishiguro; Katsuaki Suganuma (IROS, 2007)

Properties of low temperature Sn-Ag-Bi-In solder systems. - Keun-Soo Kim; Takayuki Imanishi; Katsuaki Suganuma; Minoru Ueshima; Rikiya Kato (Microelectron. Reliab., 2007)

Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system. - Kimihiro Yamanaka; Yutaka Tsukada; Katsuaki Suganuma (Microelectron. Reliab., 2007)

Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint. - Kiju Lee; Keun-Soo Kim; Yutaka Tsukada; Katsuaki Suganuma; Kimihiro Yamanaka; Soichi Kuritani; Minoru Ueshima (Microelectron. Reliab., 2011)

Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish. - Hitoshi Sakurai; Keun-Soo Kim; Kiju Lee; Chang-Jae Kim; Youichi Kukimoto; Katsuaki Suganuma (Microelectron. Reliab., 2012)

Evaluation of Stretchable Conductor for Measuring Clothing Pressure. - Katsunari Sato; Sayasa Otsubo; Teppei Araki; Tohru Sugahara; Katsuaki Suganuma (EuroHaptics (2), 2014)

Introduction to Printed Electronics - Katsuaki Suganuma (Springer, 2014)

Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density. - Takuya Kadoguchi; Keisuke Gotou; Kimihiro Yamanaka; Shijo Nagao; Katsuaki Suganuma (Microelectron. Reliab., 2015)

Power electronics packaging. - Katsuaki Suganuma; Jenn-Ming Song; Yi-Shao Lai (Microelectron. Reliab., 2015)

Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver. - Chanyang Choe; Seungjun Noh; Chuantong Chen; Dongjin Kim 002; Katsuaki Suganuma (Microelectron. Reliab., 2018)

Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure. - Dongjin Kim 002; Chuantong Chen; Aiji Suetake; Chanyang Choe; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma (Microelectron. Reliab., 2018)

Large-area die-attachment by silver stress migration bonding for power device applications. - Seungjun Noh; Hao Zhang 043; Jeyun Yeom; Chuantong Chen; Caifu Li; Katsuaki Suganuma (Microelectron. Reliab., 2018)