High-performance FCBGA based on multi-layer thin-substrate packaging technology. - Tadanori Shimoto; Katsumi Kikuchi; Kazuhiro Baba; Koji Matsui; Hirokazu Honda; Keiichiro Kata (Microelectron. Reliab., 2004)

Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs. - Tadanori Shimoto; Kazuhiro Baba; Koji Matsui; Jun Tsukano; Takehiko Maeda; Kenji Oyachi (Microelectron. Reliab., 2005)

Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates. - Katsuya Kikuchi; Koichi Takemura; Chihiro Ueda; Osamu Shimada; Toshio Gomyo; Yukiharu Takeuchi; Toshikazu Okubo; Kazuhiro Baba; Masahiro Aoyagi; Toshio Sudo; Kanji Otsuka (3DIC, 2009)

SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration. - Koichi Takemura; Katsuya Kikuchi; Chihiro Ueda; Kazuhiro Baba; Masahiro Aoyagi; Kanji Otsuka (3DIC, 2009)

3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's. - Koichi Ishida; Koichi Takemura; Kazuhiro Baba; Makoto Takamiya; Takayasu Sakurai (3DIC, 2010)