RESPACK: An ab initio tool for derivation of effective low-energy model of material. - Kazuma Nakamura; Yoshihide Yoshimoto; Yusuke Nomura; Terumasa Tadano; Mitsuaki Kawamura; Taichi Kosugi; Kazuyoshi Yoshimi; Takahiro Misawa; Yuichi Motoyama (Comput. Phys. Commun., 2021)

MoHeat: A Modular Platform for High-Responsive Non-Contact Thermal Feedback Interactions. - Jiayi Xu; Kazuma Nakamura; Yoshihiro Kuroda; Masahiko Inami (CoRR, 2024)