3D interconnected technology by high speed copper electrodeposition using diallylamine levelers. - Taro Hayashi; Kazuo Kondo; Minoru Takeuchi; Yushi Suzuki; Takeyasu Saito; Naoki Okamoto; Masao Marunaka; Takayuki Tsuchiya; Masaru Bunya (3DIC, 2011)

No pumping at 450°C with electrodeposited copper TSV. - Kazuo Kondo; Shingo Mukahara; Masayuki Yokoi; Jin Onuki (3DIC, 2015)

Reduction of TSV Pumping. - Quy Dinh; Kazuo Kondo; Tetsuji Hirato (3DIC, 2019)