Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. - Takafumi Fukushima; Taku Suzuki; Hideto Hashiguchi; Chisato Nagai; Jichoel Bea; Hiroyuki Hashimoto; Mariappan Murugesan; Kang Wook Lee 002; Tetsu Tanaka; Kazushi Asami; Yasuhiro Kitamura; Mitsumasa Koyanagi (3DIC, 2015)