Warpage analysis of organic substrates for 2.1D packaging. - Sayuri Kohara; Keishi Okamoto; Hirokazu Noma; Kazushige Toriyama; Hiroyuki Mori (3DIC, 2015)

Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration. - Kuniaki Sueoka; Akihiro Horibe; T. Aoki; Sayuri Kohara; Kazushige Toriyama; Hiroyuki Mori; Yasumitsu Orii (3DIC, 2015)