MuCCRA-Cube: A 3D dynamically reconfigurable processor with inductive-coupling link. - Shotaro Saito; Yoshinori Kohama; Yasufumi Sugimori; Yohei Hasegawa; Hiroki Matsutani; Toru Sano; Kazutaka Kasuga; Yoichi Yoshida; Kiichi Niitsu; Noriyuki Miura; Tadahiro Kuroda; Hideharu Amano (FPL, 2009)

An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. - Kiichi Niitsu; Yasuhisa Shimazaki; Yasufumi Sugimori; Yoshinori Kohama; Kazutaka Kasuga; Itaru Nonomura; Makoto Saen; Shigenobu Komatsu; Kenichi Osada; Naohiko Irie; Toshihiro Hattori; Atsushi Hasegawa; et al. (ISSCC, 2009)

An 8Tb/s 1pJ/b 0.8mm2/Tb/s QDR inductive-coupling interface between 65nm CMOS GPU and 0.1µm DRAM. - Noriyuki Miura; Kazutaka Kasuga; Mitsuko Saito; Tadahiro Kuroda (ISSCC, 2010)

3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link. - Makoto Saen; Kenichi Osada; Yasuyuki Okuma; Kiichi Niitsu; Yasuhisa Shimazaki; Yasufumi Sugimori; Yoshinori Kohama; Kazutaka Kasuga; Itaru Nonomura; Naohiko Irie; Toshihiro Hattori; Atsushi Hasegawa; et al. (IEEE J. Solid State Circuits, 2010)

Modeling and Experimental Verification of Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for Low-Power 3-D System Integration. - Kiichi Niitsu; Yoshinori Kohama; Yasufumi Sugimori; Kazutaka Kasuga; Kenichi Osada; Naohiko Irie; Hiroki Ishikuro; Tadahiro Kuroda (IEEE Trans. Very Large Scale Integr. Syst., 2010)