A Novel Selected Area Laser Assisted (SALA) System for Crystallization and Doping Processes in Low-Temperature Poly-Si Thin-Film Transistors. - Ryoichi Ishihara; Arie Glazer; Yoel Raab; Peter Rusian; Mannie Dorfan; Benzi Lavi; Ilya Leizerson; Albert Kishinevsky; Yvonne Van Andel; Xin Cao; Wim Metselaar; Kees Beenakker; et al. (IEICE Trans. Electron., 2006)

Single-grain Si thin-film transistors for analog and RF circuit applications. - Nitz Saputra; Mina Danesh; Alessandro Baiano; Ryoichi Ishihara; John R. Long; Wim Metselaar; C. I. M. Beenakker; Nobuo Karaki; Y. Hiroshima; Satoshi Inoue (ESSCIRC, 2007)

Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon. - Negin Golshani; Jaber Derakhshandeh; Ryoichi Ishihara; C. I. M. Beenakker; Michael Robertson; Thomas Morrison (3DIC, 2010)

Test Cost Analysis for 3D Die-to-Wafer Stacking. - Mottaqiallah Taouil; Said Hamdioui; Kees Beenakker; Erik Jan Marinissen (Asian Test Symposium, 2010)

Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits. - Sten Vollebregt; Ryoichi Ishihara; Johan van der Cingel; Kees Beenakker (3DIC, 2011)

Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost. - Mottaqiallah Taouil; Said Hamdioui; Kees Beenakker; Erik Jan Marinissen (J. Electron. Test., 2012)

Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics. - Ryoichi Ishihara; Jin Zhang; Miki Trifunovic; Jaber Derakhshandeh; Negin Golshani; Daniel M. R. Tajari Mofrad; Tao Chen; Kees Beenakker; Tatsuya Shimoda (IEICE Trans. Electron., 2014)