Study of silicon core coaxial through silicon via for three dimensional integration. - Libo Qian; Xitao He; Kefang Qian; Yinshui Xia (ISCAS, 2018)

Through-Silicon Via-Based Capacitor and Its Application in LDO Regulator Design. - Libo Qian; Kefang Qian; Xitao He; Zhufei Chu; Yidie Ye; Shi Ge 001; Yinshui Xia (IEEE Trans. Very Large Scale Integr. Syst., 2019)

A Fast-Transient Response Digital Low-Dropout Regulator With Dual-Modes Tuning Technique. - Libo Qian; Da Li; Kefang Qian; Yidie Ye; Yinshui Xia; Terrence S. T. Mak (IEEE Trans. Circuits Syst., 2020)

TSV Based Orthogonal Coils With High Misalignment Tolerance for Inductive Power Transfer in Biomedical Implants. - Libo Qian; Kefang Qian; Yong Shi; Huakang Xia; Jian Wang; Yinshui Xia (IEEE Trans. Circuits Syst. II Express Briefs, 2021)

A self-powered interface circuit for piezoelectric and photovoltaic energy extracting. - Kefang Qian; Huakang Xia; Yinshui Xia (Microelectron. J., 2024)

A Capacitor-Less Digital Low-Dropout Regulator With Self-Clocked Operation. - Kefang Qian; Dashan Wang; Yinshui Xia (IEEE Trans. Circuits Syst. II Express Briefs, 2024)