Application of AI technology based on customer service digitalization. - Kefeng Yu; Liping Zhang; Yingmao Hu; Ying Wu (ICISS, 2022)

Research on Complaint Operation Management System Based on digital Transformation. - Liping Zhang; Kefeng Yu; Yingmao Hu; Ying Wu (ICISS, 2022)

Research on Intelligent Customer Service Application Architecture Based on Digital Transformation. - Liping Zhang; Kefeng Yu; Jiangang Tong; Man Li; Yingmao Hu; Ying Wu (ICISS, 2022)

Research and Construction of Cloud Platform for Service Aggregation and Management of China Telecom's Offline Contacts. - Ying Wu; Kefeng Yu (ICISS, 2023)

Research and Exploration of Intelligent Scheduling System in Call Center Based on Time Slicing. - Kefeng Yu; Liping Zhang; Yingmao Hu; Ying Wu; Chengwei Yang (ICISS, 2023)

Design of Business Rule Model for Telecom Operator Support System. - Kefeng Yu; Liping Zhang; Yingmao Hu; Ying Wu; Chengwei Yang (ICISS, 2023)

Self-supervised Multimodal Representation Learning for Product Identification and Retrieval. - Yiquan Jiang; Kengte Liao; Shoude Lin; Hongming Qiao; Kefeng Yu; Chengwei Yang; Yinqi Chen (ICONIP (11), 2023)

A Fully Digital SRAM-Based Four-Layer In-Memory Computing Unit Achieving Multiplication Operations and Results Store. - Zhiting Lin; Shaoying Zhang; Qian Jin; Jianping Xia; Yunwei Liu; Kefeng Yu; Jian Zheng; Xiaoming Xu; Xing Fan; Ke Li; Zhongzhen Tong; Xiulong Wu; et al. (IEEE Trans. Very Large Scale Integr. Syst., 2023)

Exploration and realization of the digital transformation of the whole process of digital ecological business LTC. - Kefeng Yu; Liping Zhang (ICISS, 2024)

A 9T-SRAM based computing-in-memory with redundant unit and digital operation for boolean logic and MAC. - Xin Li 099; Mengya Gao; Zihua Ren; Kefeng Yu; Wenjuan Lu; Chenghu Dai; Wei Hu; Chunyu Peng; Xiulong Wu (Microelectron. J., 2024)

Corrigendum to "A 9T-SRAM based computing-in-memory with redundant unit and digital operation for boolean logic and MAC" [145, March 2024, 106124. - Xin Li 099; Mengya Gao; Zihua Ren; Kefeng Yu; Wenjuan Lu; Chenghu Dai; Wei Hu; Chunyu Peng; Xiulong Wu (Microelectron. J., 2024)