Etch, dielectrics and metal barrier-seed for low temperature through-silicon via processing. - Keith Buchanan; Stephen Burgess; Kathrine Giles; Matthew Muggeridge; Hao Zhao (3DIC, 2009)

Plasma etch and dielectric deposition processes for TSV Reveal. - Keith Buchanan; Dave Thomas; Hefin Griffiths; Kathrine Crook; Daniel Archard; Mark Carruthers; Masahiko Tanaka (3DIC, 2011)