The influence of solder composition on the impact strength of lead-free solder ball grid array joints. - H. Tsukamoto; T. Nishimura; S. Suenaga; Stuart D. McDonald; Keith W. Sweatman; Kazuhiro Nogita (Microelectron. Reliab., 2011)

The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review. - Shi-Qian Liu; Stuart D. McDonald; Keith W. Sweatman; Kazuhiro Nogita (Microelectron. Reliab., 2018)