Leak-Proof Packaging for GaN Chip with Controlled Thermal Spreading and Transients. - Yasuo Saito; Tatsuhiko Aizawa; Kenji Wasa; Yoshiro Nogami (BCICTS, 2018)

Fabrication of Superhydrophobic Stainless Steel Nozzles by Femtosecond Laser Micro-/Nano-Texturing. - Tatsuhiko Aizawa; Tadahiko Inohara; Kenji Wasa (Int. J. Autom. Technol., 2020)

Fabrication of Optimally Micro-Textured Copper Substrates by Plasma Printing for Plastic Mold Packaging. - Tatsuhiko Aizawa; Yasuo Saito; Hideharu Hasegawa; Kenji Wasa (Int. J. Autom. Technol., 2020)