Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. - Chao-Kun Hu; Kenneth P. Rodbell; Timothy D. Sullivan; Kim Y. Lee; Dennis P. Bouldin (IBM J. Res. Dev., 1995)

Single-event-upset and alpha-particle emission rate measurement techniques. - Michael S. Gordon; Kenneth P. Rodbell; David F. Heidel; Cyril Cabral Jr.; Ethan H. Cannon; Daniel D. Reinhardt (IBM J. Res. Dev., 2008)

Preface. - David F. Heidel; Jack Hergenrother; Kenneth P. Rodbell (IBM J. Res. Dev., 2008)

Alpha-particle-induced upsets in advanced CMOS circuits and technology. - David F. Heidel; Kenneth P. Rodbell; Ethan H. Cannon; Cyril Cabral Jr.; Michael S. Gordon; Phil Oldiges; Henry H. K. Tang (IBM J. Res. Dev., 2008)

New simulation methodology for effects of radiation in semiconductor chip structures. - Henry H. K. Tang; Conal E. Murray; Giovanni Fiorenza; Kenneth P. Rodbell; Michael S. Gordon; David F. Heidel (IBM J. Res. Dev., 2008)

The resilience wall: Cross-layer solution strategies. - Subhasish Mitra; Pradip Bose; Eric Cheng; Chen-Yong Cher; Hyungmin Cho; Rajiv V. Joshi; Young Moon Kim; Charles R. Lefurgy; Yanjing Li; Kenneth P. Rodbell; Kevin Skadron; James H. Stathis; et al. (VLSI-DAT, 2014)

SOI FinFET soft error upset susceptibility and analysis. - Phil Oldiges; Kenneth P. Rodbell; Michael S. Gordon; John G. Massey; Kevin Stawiasz; Conal E. Murray; Henry H. K. Tang; K. Kim; K. Paul Muller (IRPS, 2015)