The effect of tin grain structure on whisker growth. - Cheng-Fu Yu; Chi-Ming Chan; Ker-Chang Hsieh (Microelectron. Reliab., 2010)

Cu wire bond microstructure analysis and failure mechanism. - Cheng-Fu Yu; Chi-Ming Chan; Li-Chun Chan; Ker-Chang Hsieh (Microelectron. Reliab., 2011)

Development of Novel Lightweight Dual-Phase Al-Ti-Cr-Mn-V Medium-Entropy Alloys with High Strength and Ductility. - Yu-Chin Liao; Po-Sung Chen; Chao-Hsiu Li; Pei-Hua Tsai; Jason S. C. Jang; Ker-Chang Hsieh; Chih-Yen Chen; Ping-Hung Lin; Jacob C. Huang; Hsin-Jay Wu; Yu-Chieh Lo; Chang-Wei Huang; et al. (Entropy, 2020)