Prediction and verification of process induced warpage of electronic packages. - W. D. van Driel; G. Q. Zhang; J. H. J. Janssen; Leo J. Ernst; Fei Su; Kerm Sin Chian; Sung Yi (Microelectron. Reliab., 2003)

An optical characterization technique for hygroscopic expansion of polymers and plastic packages. - Fei Su; Kerm Sin Chian; Sung Yi (Microelectron. Reliab., 2006)