Properties of low temperature Sn-Ag-Bi-In solder systems. - Keun-Soo Kim; Takayuki Imanishi; Katsuaki Suganuma; Minoru Ueshima; Rikiya Kato (Microelectron. Reliab., 2007)

Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint. - Kiju Lee; Keun-Soo Kim; Yutaka Tsukada; Katsuaki Suganuma; Kimihiro Yamanaka; Soichi Kuritani; Minoru Ueshima (Microelectron. Reliab., 2011)

Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish. - Hitoshi Sakurai; Keun-Soo Kim; Kiju Lee; Chang-Jae Kim; Youichi Kukimoto; Katsuaki Suganuma (Microelectron. Reliab., 2012)