A new IC interconnection scheme and design architecture for high performance ICs at very low fabrication cost - post passivation interconnection. - M. S. Lin; Ling Chen; J. Y. Lee; H. T. Liu; C. K. Chou; K. H. Wan; H. M. Chen; Kevin Chou; Roger Hsiao; Eric Lin (CICC, 2003)

Geometric consideration of support structures in part overhang fabrications by electron beam additive manufacturing. - Bo Cheng; Kevin Chou (Comput. Aided Des., 2015)