Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages. - Peter Alpern; Kheng Chooi Lee; Rainer Tilgner (Microelectron. Reliab., 2004)

A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages. - Kheng Chooi Lee; A. Vythilingam; Peter Alpern (Microelectron. Reliab., 2005)

Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. - Marvin Chan; Cher Ming Tan; Kheng Chooi Lee; Chuan Seng Tan (Microelectron. Reliab., 2016)