Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. - Taigon Song; Chang Liu 034; Dae Hyun Kim 004; Sung Kyu Lim; Jonghyun Cho; Joohee Kim; Junso Pak; Seungyoung Ahn; Joungho Kim; Kihyun Yoon (ISQED, 2011)