Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging. - Takuya Wadatsumi; Kohei Kawai; Rikuu Hasegawa; Takuji Miki; Makoto Nagata; Kikuo Muramatsu; Hiromu Hasegawa; Takuya Sawada; Takahito Fukushima; Hisashi Kondo (IRPS, 2022)

Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging. - Takuya Wadatsumi; Kohei Kawai; Rikuu Hasegawa; Kikuo Muramatsu; Hiromu Hasegawa; Takuya Sawada; Takahito Fukushima; Hisashi Kondo; Takuji Miki; Makoto Nagata (IEICE Trans. Electron., 2023)