Integrated optoelectronics-to-VLSI packaging technology. - C. G. Lin-Hendel; W. J. Bertram; M. S. Dhanaliwala; R. J. Pimpinella; J. M. Segelken; King L. Tai (ICCD, 1989)

Trends in Silicon-On-Silicon Multichip Modules. - Robert C. Frye; King L. Tai; Maureen Y. Lau; Thaddeus J. Gabara (IEEE Des. Test Comput., 1993)

Chip-scale modules for high-level integration in the 21st century. - Jeffrey A. Gregus; Maureen Y. Lau; Yinon Degani; King L. Tai (Bell Labs Tech. J., 1998)

A New Bare Die Test Methodology. - Zao Yang; Kwang-Ting Cheng; King L. Tai (VTS, 1999)

System-in-package (SIP): challenges and opportunities. - King L. Tai (ASP-DAC, 2000)

Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology. - Michael X. Wang; Katsuharu Suzuki; Wayne Wei-Ming Dai; Yee L. Low; Kevin J. O'Conner; King L. Tai (ASP-DAC, 2000)