Three-dimensional impedance engineering for mixed-signal system-on-chip applications. - Kyuchul Chong; Xi Zhang; King-Ning Tu; Daquan Huang; Mau-Chung Frank Chang; Ya-Hong Xie (CICC, 2005)

A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects. - M. Y. Yan; King-Ning Tu; A. V. Vairagar; S. G. Mhaisalkar; Ahila Krishnamoorthy (Microelectron. Reliab., 2006)

Recent research advances in Pb-free solders. - Yi-Shao Lai; Ho-Ming Tong; King-Ning Tu (Microelectron. Reliab., 2009)

Reliability challenges in 3D IC packaging technology. - King-Ning Tu (Microelectron. Reliab., 2011)

Reliability of micro-interconnects in 3D IC packages. - C. Robert Kao; Albert T. Wu; King-Ning Tu; Yi-Shao Lai (Microelectron. Reliab., 2013)

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy. - King-Ning Tu; Hsiang-Yao Hsiao; Chih Chen (Microelectron. Reliab., 2013)

Growth competition between layer-type and porous-type Cu3Sn in microbumps. - David T. Chu; Yi-Cheng Chu; Jie-An Lin; Yi-Ting Chen; Chun-Chieh Wang; Yen-Fang Song; Cheng-Cheng Chiang; Chih Chen; King-Ning Tu (Microelectron. Reliab., 2017)

Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology. - Yulong Chen; Xiewen Wen; King-Ning Tu; Yingxia Liu (ICTA, 2023)