The emerging power crisis in embedded processors: what can a poor compiler do? - Lakshmi N. Chakrapani; Pinar Korkmaz; Vincent John Mooney III; Krishna V. Palem; Kiran Puttaswamy; Weng-Fai Wong (CASES, 2001)

System Level Power-Performance Trade-Offs in Embedded Systems Using Voltage and Frequency Scaling of Off-Chip Buses and Memory. - Abhijit Chatterjee; Peeter Ellervee; Vincent John Mooney III; Jun-Cheol Park; Kyu-won Choi; Kiran Puttaswamy (ISSS, 2002)

Design space optimization of embedded memory systems via data remapping. - Krishna V. Palem; Rodric M. Rabbah; Vincent John Mooney; Pinar Korkmaz; Kiran Puttaswamy (LCTES-SCOPES, 2002)

Possibility and Limitation of a Hardware-Assisted Data Prefetching Framework Using Off-Line Training of Markovian Predictors. - Jinwoo Kim; Kiran Puttaswamy (CDES, 2005)

Implementing Caches in a 3D Technology for High Performance Processors. - Kiran Puttaswamy; Gabriel H. Loh (ICCD, 2005)

Entropy-based low power data TLB design. - Chinnakrishnan S. Ballapuram; Kiran Puttaswamy; Gabriel H. Loh; Hsien-Hsin S. Lee (CASES, 2006)

Thermal analysis of a 3D die-stacked high-performance microprocessor. - Kiran Puttaswamy; Gabriel H. Loh (ACM Great Lakes Symposium on VLSI, 2006)

Dynamic instruction schedulers in a 3-dimensional integration technology. - Kiran Puttaswamy; Gabriel H. Loh (ACM Great Lakes Symposium on VLSI, 2006)

The impact of 3-dimensional integration on the design of arithmetic units. - Kiran Puttaswamy; Gabriel H. Loh (ISCAS, 2006)

Implementing Register Files for High-Performance Microprocessors in a Die-Stacked (3D) Technology. - Kiran Puttaswamy; Gabriel H. Loh (ISVLSI, 2006)

Scalability of 3D-Integrated Arithmetic Units in High-Performance Microprocessors. - Kiran Puttaswamy; Gabriel H. Loh (DAC, 2007)

Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated Processors. - Kiran Puttaswamy; Gabriel H. Loh (HPCA, 2007)

Designing High-Performance Microprocessors in 3-Dimensional Integration Technology. - Kiran Puttaswamy (2007)

3D-Integrated SRAM Components for High-Performance Microprocessors. - Kiran Puttaswamy; Gabriel H. Loh (IEEE Trans. Computers, 2009)