Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation. - David Dalleau; Kirsten Weide-Zaage (Microelectron. Reliab., 2001)

Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures. - David Dalleau; Kirsten Weide-Zaage; Yves Danto (Microelectron. Reliab., 2003)

How to study delamination in plastic encapsulated devices. - Hélène Frémont; Jean-Yves Delétage; Kirsten Weide-Zaage; Yves Danto (Microelectron. Reliab., 2004)

Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations. - Kirsten Weide-Zaage; Walter Horaud; Hélène Frémont (Microelectron. Reliab., 2005)

Dynamic void formation in a DD-copper-structure with different metallization geometry. - Kirsten Weide-Zaage; David Dalleau; Yves Danto; Hélène Frémont (Microelectron. Reliab., 2007)

Simulation of migration effects in nanoscaled copper metallizations. - Kirsten Weide-Zaage; Farzan Kashanchi; Oliver Aubel (Microelectron. Reliab., 2008)

Determination of migration effects in Cu-via structures with respect to process-induced stress. - Kirsten Weide-Zaage; Jiani Zhao; Joharsyah Ciptokusumo; Oliver Aubel (Microelectron. Reliab., 2008)

Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling. - Joharsyah Ciptokusumo; Kirsten Weide-Zaage; Oliver Aubel (Microelectron. Reliab., 2009)

Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization. - Irina Bauer; Kirsten Weide-Zaage; Lutz Meinshausen (Microelectron. Reliab., 2011)

Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. - Lutz Meinshausen; Kirsten Weide-Zaage; Hélène Frémont (Microelectron. Reliab., 2011)

A design for robust wide metal tracks. - Markus Ackermann 002; Verena Hein; Christian Kovács; Kirsten Weide-Zaage (Microelectron. Reliab., 2012)

Simulation of the influence of TiAl3 layers on the thermal-electrical and mechanical behaviour of Al metallizations. - Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein (Microelectron. Reliab., 2012)

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage (Microelectron. Reliab., 2012)

Electro- and thermo-migration induced failure mechanisms in Package on Package. - Lutz Meinshausen; Kirsten Weide-Zaage; Hélène Frémont (Microelectron. Reliab., 2012)

Dynamic simulation of octahedron slotted metal structures. - Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein (Microelectron. Reliab., 2013)

Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage; Bernard Plano (Microelectron. Reliab., 2013)

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. - Aymen Moujbani; Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein; Lutz Meinshausen (Microelectron. Reliab., 2013)

Simulation in 3D integration and TSV. - Kirsten Weide-Zaage; Aymen Moujbani; Jörg Kludt (LASCAS, 2014)

Qualification procedure for moisture in embedded capacitors. - Hélène Frémont; Jörg Kludt; Massar Wade; Kirsten Weide-Zaage; Isabelle Bord-Majek; Geneviève Duchamp (Microelectron. Reliab., 2014)

Evaluation new corner stress relief structure layout for high robust metallization. - Verena Hein; Jörg Kludt; Kirsten Weide-Zaage (Microelectron. Reliab., 2014)

Degradation behavior in upstream/downstream via test structures. - Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein; Christian Kovács (Microelectron. Reliab., 2014)

Reliability of Wafer Level Chip Scale Packages. - R. T. H. Rongen; R. Roucou; P. J. vd Wel; F. C. Voogt; F. Swartjes; Kirsten Weide-Zaage (Microelectron. Reliab., 2014)

Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. - Kirsten Weide-Zaage; J. Schlobohm; R. T. H. Rongen; F. C. Voogt; R. Roucou (Microelectron. Reliab., 2014)

Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage; Bernard Plano (Microelectron. Reliab., 2015)

Dynamical IMC-growth calculation. - Lutz Meinshausen; Kirsten Weide-Zaage; Hélène Frémont (Microelectron. Reliab., 2015)

Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys. - Mohd Faizul Mohd Sabri; Nor Ilyana Muhd Nordin; Suhana Mohd Said; Nur Aishah Aminah Mohd Amin; Hamzah Arof; Iswadi Jauhari; Roziana Ramli; Kirsten Weide-Zaage (Microelectron. Reliab., 2015)

Effects of salt spray test on lead-free solder alloy. - Alexandrine Guédon-Gracia; Hélène Frémont; Bernard Plano; Jean-Yves Delétage; Kirsten Weide-Zaage (Microelectron. Reliab., 2016)

Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. - Verena Hein; Marco Erstling; Raj Sekar Sethu; Kirsten Weide-Zaage; Tianlin Bai (Microelectron. Reliab., 2016)

Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation). - Kirsten Weide-Zaage (Microelectron. Reliab., 2017)

Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology. - Eike Trumann; Gia Bao Thieu; Johannes Schmechel; Kirsten Weide-Zaage; Katharina Schmidt; Dorian Hagenah; Guillermo Payá Vayá (ARC, 2023)