Pb-free high temperature solders for power device packaging. - Yasushi Yamada; Yoshikazu Takaku; Yuji Yagi; Y. Nishibe; Ikuo Ohnuma; Yuji Sutou; R. Kainuma; Kiyohito Ishida (Microelectron. Reliab., 2006)

Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device. - Yasushi Yamada; Yoshikazu Takaku; Yuji Yagi; Ikuo Nakagawa; Takashi Atsumi; Mikio Shirai; Ikuo Ohnuma; Kiyohito Ishida (Microelectron. Reliab., 2007)