TSV reveal etch for 3D integration. - Stephen Olson; Klaus Hummler (3DIC, 2011)

Emerging CMOS and beyond CMOS technologies for an ultra-low power 3D world. - Chang Yong Kang; K. W. Ang; R. Hill; W. Y. Loh; Jungwoo Oh; Rinus Lee; David Gilmer; Gennadi Bersuker; C. Hobbs; Paul Kirsch; Klaus Hummler; S. Arkalgud; et al. (ICICDT, 2012)