Wireless communication integrated circuits with CMOS-compatible SiGe HBT technology modules. - Wolfgang Winkler; Johannes Borngräber; Heide Erzgraeber; Ha. Erzgraber; Bernd Heinemann; Dieter Knoll; H. Jörg Osten; Michael Pierschel; Klaus Pressel; Peter Schley (CICC, 1999)

A current-folded up-conversion mixer and VCO with center-tapped inductor in a SiGe-HBT technology for 5-GHz wireless LAN applications. - Günter Grau; Ulrich Langmann; Wolfgang Winkler; Dieter Knoll; Jörg Osten; Klaus Pressel (IEEE J. Solid State Circuits, 2000)

Modern IC packaging trends and their reliability implications. - R. Plieninger; M. Dittes; Klaus Pressel (Microelectron. Reliab., 2006)

Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests. - Jens Heilmann; Ivan Nikitin; Uwe Zschenderlein; Daniel May; Klaus Pressel; Bernhard Wunderle (Microelectron. Reliab., 2017)

I. Double-Sided Cooling Technology for Emobility. - Klaus Pressel; Andreas Grassmann; Markus Fink; Guenter Tutsch (ESSDERC, 2019)

The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0). - Klaus Pressel; Josef Moser; Sven Rzepka; Klas Brinkfeldt; Susan Zhao; Willem D. van Driel; Paolo Giammatteo; Baris Bulut; Müjdat Soytürk; Luigi Pomante (DSD, 2021)