Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer. - Souvik Ghosh 001; Quentin Smets; S. Banerjee; Tom Schram; Koen Kennes; R. Verheyen; P. Kumar; M.-E. Boulon; Benjamin Groven; H. M. Silva; Shreya Kundu; Daire Cott; et al. (VLSI Technology and Circuits, 2023)

Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration. - Akito Hiro; Damien Jon Leech; Geert Schoofs; John Slabbekoorn; Alain Phommahaxay; Koen Kennes; Gerald Beyer; Eric Beyne (3DIC, 2024)

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer. - Pengfei Xu; Junwen He; Koen Kennes; Anton Dvoretskii; Arnita Podpod; Guy Lepage; Negin Golshani; Rafal Magdziak; Swetanshu Bipul; Dieter Bode; Peter Verheyen; Maumita Chakrabarti; et al. (OFC, 2024)