Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates. - Katsuya Kikuchi; Koichi Takemura; Chihiro Ueda; Osamu Shimada; Toshio Gomyo; Yukiharu Takeuchi; Toshikazu Okubo; Kazuhiro Baba; Masahiro Aoyagi; Toshio Sudo; Kanji Otsuka (3DIC, 2009)

SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration. - Koichi Takemura; Katsuya Kikuchi; Chihiro Ueda; Kazuhiro Baba; Masahiro Aoyagi; Kanji Otsuka (3DIC, 2009)

3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's. - Koichi Ishida; Koichi Takemura; Kazuhiro Baba; Makoto Takamiya; Takayasu Sakurai (3DIC, 2010)

5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF. - Kenichiro Yashiki; Yasuyuki Suzuki; Yasuhiko Hagihara; Mitsuru Kurihara; Masatoshi Tokushima; Junichi Fujikata; Akio Ukita; Koichi Takemura; Takanori Shimizu; Daisuke Okamoto; Jun Ushida; Shigeki Takahashi; et al. (OFC, 2015)

Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers. - Koichi Takemura; Akio Ukita; Yasuhiro Ibusuki; Mitsuru Kurihara; Akihiro Noriki; Takeru Amano; Daisuke Okamoto; Yasuyuki Suzuki; Kazuhiko Kurata (3DIC, 2019)

Fingertip-Size Optical Module, "Optical I/O Core", and Its Application in FPGA. - Takahiro Nakamura; Kenichiro Yashiki; Kenji Mizutani; Takaaki Nedachi; Junichi Fujikata; Masatoshi Tokushima; Jun Ushida; Masataka Noguchi; Daisuke Okamoto; Yasuyuki Suzuki; Takanori Shimizu; Koichi Takemura; et al. (IEICE Trans. Electron., 2019)

Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors. - Akihiro Noriki; Isao Tamai; Yasuhiro Ibusuki; Akio Ukita; Satoshi Suda; Koichi Takemura; Daisuke Shimura; Yosuke Onawa; Hiroki Yaegashi; Takeru Amano (ECOC, 2020)

Error-Free Operation for Fully Connected Wavelength-Routing Interconnect among 8 FPGAs with 2.8-Tbit/s Total Bandwidth. - Takanori Shimizu; Shigeru Nakamura; Hiroshi Yamaguchi; Koichi Takemura; Kenji Mizutani; Tatsuya Usuki; Yutaka Urino (ECOC, 2021)

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate. - Takeru Amano; Akihiro Noriki; Isao Tamai; Yasuhiro Ibusuki; Akio Ukita; Satoshi Suda; Takayuki Kurosu; Koichi Takemura; Tsuyoshi Aoki; Daisuke Shimura; Yosuke Onawa; Hiroki Yaegashi (OFC, 2021)