High-bandwidth data transmission of new transceiver module through optical interconnection. - Yuka Ito; Shinsuke Terada; Shinya Arai; Koji Choki; Takafumi Fukushima; Mitsumasa Koyanagi (3DIC, 2011)

Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. - Takafumi Fukushima; Yuka Ito; Mariappan Murugesan; Jicheol Bea; Kang Wook Lee 002; Koji Choki; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2014)