High-performance FCBGA based on multi-layer thin-substrate packaging technology. - Tadanori Shimoto; Katsumi Kikuchi; Kazuhiro Baba; Koji Matsui; Hirokazu Honda; Keiichiro Kata (Microelectron. Reliab., 2004)

Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs. - Tadanori Shimoto; Kazuhiro Baba; Koji Matsui; Jun Tsukano; Takehiko Maeda; Kenji Oyachi (Microelectron. Reliab., 2005)

The Learning Environment for Stars and Constellations in the Real World with Finger Pointing. - Masato Soga; Masafumi Miwa; Koji Matsui; Kazuki Takaseki; Kohe Tokoi; Hirokazu Taki (DIGITEL, 2008)

Interactive Learning Environment for Astronomy with Finger Pointing and Augmented Reality. - Masato Soga; Koji Matsui; Kazuki Takaseki; Kohe Tokoi (ICALT, 2008)

Tactile Estimation of Molded Plastic Plates Based on the Estimated Impulse Responses of Mechanoreceptive Units. - Lisako Nobuyama; Yuta Kurashina; Kei Kawauchi; Koji Matsui; Kenjiro Takemura (Sensors, 2018)