Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology. - Guan Zhang; Cher Ming Tan; Kok Tong Tan; Derek Sim Kwang Ye; W. Y. Zhang (Microelectron. Reliab., 2004)

Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects. - Cher Ming Tan; Arijit Roy 001; Kok Tong Tan; Derek Sim Kwang Ye; Frankie Low (Microelectron. Reliab., 2005)

Development of highly accelerated electromigration test. - Cher Ming Tan; Wei Li; Kok Tong Tan; Frankie Low (Microelectron. Reliab., 2006)