Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies. - Piotr Mackowiak; Samer Al-Magazachi; Klaus-Dieter Lang; Kolja Erbacher; Manuel Bäuscher; Ha-Duong Ngo; Kai Zoschke; Michael Schiffer (DeSE, 2019)

Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor. - Piotr Mackowiak; Kolja Erbacher; Manuel Baeuscher; Michael Schiffer; Klaus-Dieter Lang; Martin Schneider-Ramelow; Ha-Duong Ngo (IEEE SENSORS, 2021)