Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. - Vincent Fiori; Komi-Atchou Ewuame; Sébastien Gallois-Garreignot; Hervé Jaouen; Clément Tavernier (Microelectron. Reliab., 2014)

Thermo-mechanical characterization of passive stress sensors in Si interposer. - Benjamin Vianne; Pierre Bar; Vincent Fiori; Sébastien Gallois-Garreignot; Komi-Atchou Ewuame; Pascal Chausse; Stéphanie Escoubas; Nicolas Hotellier; Olivier Thomas (Microelectron. Reliab., 2015)