An investigation of dielectric thickness scaling on BEOL TDDB. - Tian Shen; Wenyi Zhang; Kong Boon Yeap; Jing Tan; Walter Yao; Patrick Justison (IRPS, 2015)

Impact of electrode surface modulation on time-dependent dielectric breakdown. - Kong Boon Yeap; Tian Shen; Galor Wenyi Zhang; Sing Fui Yap; Brian Holt; Arfa Gondal; Seungman Choi; San Leong Liew; Walter Yao; Patrick Justison (IRPS, 2015)

An investigation of process dependence of porous IMD TDDB. - Wenyi Zhang; M. C. Silvestre; A. Selvam; E. Ramanathan; C. Ordonio; J. Schaller; Tian Shen; Kong Boon Yeap; C. Capasso; Patrick Justison; J. H. Lee (IRPS, 2015)

Effect of metal line width on electromigration of BEOL Cu interconnects. - Seungman Choi; Cathryn Christiansen; Linjun Cao; James Zhang; Ronald Filippi; Tian Shen; Kong Boon Yeap; Sean P. Ogden; Haojun Zhang; Bianzhu Fu; Patrick Justison (IRPS, 2018)

New insight on TDDB area scaling methodology of non-Poisson systems. - Tian Shen; Kong Boon Yeap; Sean P. Ogden; Cathryn Christiansen; Patrick Justison (IRPS, 2018)

Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness. - Sean P. Ogden; Yueming Xu; Kong Boon Yeap; Tian Shen; Toh-Ming Lu; Joel L. Plawsky (Microelectron. Reliab., 2018)