Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. - Mohandass Sivakumar; Kripesh Vaidyanathan; Chong Ser Choong; Tai Chong Chai; Loon Aik Lim (Microelectron. Reliab., 2002)

Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging. - M. Y. Pan; Manoj Gupta 002; Andrew A. O. Tay; Kripesh Vaidyanathan (Microelectron. Reliab., 2006)

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). - Xiaowu Zhang; Kripesh Vaidyanathan; Tai Chong Chai; Teck Chun Tan; D. Pinjala (Microelectron. Reliab., 2008)

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. - Xuefen Ong; Soon Wee Ho; Yue Ying Ong; Leong Ching Wai; Kripesh Vaidyanathan; Yeow Kheng Lim; David Yeo; Kai Chong Chan; Juan Boon Tan; Dong Kyun Sohn; Liang Choo Hsia; Zhong Chen 004 (Microelectron. Reliab., 2009)

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. - Yue Ying Ong; Soon Wee Ho; Kripesh Vaidyanathan; Vasarla Nagendra Sekhar; Ming Chinq Jong; Samuel Lim Yak Long; Vincent Lee Wen Sheng; Leong Ching Wai; Vempati Srinivasa Rao; Jimmy Ong; Xuefen Ong; Xiaowu Zhang; et al. (Microelectron. Reliab., 2010)