CAMELEON: a process-tolerant symbolic layout system. - Kris Croes; Hugo J. De Man; Paul Six (IEEE J. Solid State Circuits, 1988)

REDUSA: module generation by automatic elimination of superfluous blocks in regular structures. - I. Vandeweerd; Kris Croes; Luc Rijnders; Paul Six; Hugo De Man (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1989)

Efficient System Exploration and Synthesis of Applications with Dynamic Data Storage and Intensive Data Transfer. - Julio Leao da Silva Jr.; Chantal Ykman-Couvreur; Miguel Miranda; Kris Croes; Sven Wuytack; Gjalt G. de Jong; Francky Catthoor; Diederik Verkest; Paul Six; Hugo De Man (DAC, 1998)

Matisse: A System-on-Chip Design Methodology Emphasizing Dynamic Memory Management. - Diederik Verkest; Julio Leao da Silva Jr.; Chantal Ykman-Couvreur; Kris Croes; Miguel Miranda; Sven Wuytack; Francky Catthoor; Gjalt G. de Jong; Hugo De Man (J. VLSI Signal Process., 1999)

High-resolution in-situ of gold electromigration: test time reduction. - Kris Croes; R. Dreesen; Jean Manca; Ward De Ceuninck; Luc De Schepper; Luc Tielemans; P. J. van der Wel (Microelectron. Reliab., 2001)

A new degradation model and lifetime extrapolation technique for lightly doped drain nMOSFETs under hot-carrier degradation. - R. Dreesen; Kris Croes; Jean Manca; Ward De Ceuninck; Luc De Schepper; A. Pergoot; Guido Groeseneken (Microelectron. Reliab., 2001)

Statistical aspects of the degradation of LDD nMOSFETs. - E. Andries; R. Dreesen; Kris Croes; Ward De Ceuninck; Luc De Schepper; Guido Groeseneken; K. F. Lo; Marc D'Olieslaeger; Jan D'Haen (Microelectron. Reliab., 2002)

High-resolution SILC measurements of thin SiO2 at ultra low voltages. - Stefano Aresu; Ward De Ceuninck; R. Dreesen; Kris Croes; E. Andries; Jean Manca; Luc De Schepper; Robin Degraeve; Ben Kaczer; Marc D'Olieslaeger (Microelectron. Reliab., 2002)

Hardware and a Tool Chain for ADRES. - Bjorn De Sutter; Bingfeng Mei; T. Andrei Bartic; Tom Vander Aa; Mladen Berekovic; Jean-Yves Mignolet; Kris Croes; Paul Coene; Miro Cupac; Aïssa Couvreur; Andy Folens; Steven Dupont; et al. (ARC, 2006)

A tool flow for predicting system level timing failures due to interconnect reliability degradation. - Jin Guo 001; Antonis Papanikolaou; Michele Stucchi; Kristof Croes; Zsolt Tokei; Francky Catthoor (ACM Great Lakes Symposium on VLSI, 2008)

Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle. - Kristof Croes; G. Cannatá; L. Zhao; Zsolt Tökei (Microelectron. Reliab., 2008)

Automated Pathfinding tool chain for 3D-stacked integrated circuits: Practical case study. - Dragomir Milojevic; Trevor E. Carlson; Kris Croes; Riko Radojcic; Diana F. Ragett; Dirk Seynhaeve; Federico Angiolini; Geert Van der Plas; Paul Marchal (3DIC, 2009)

Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach. - Melina Lofrano; Kris Croes; Ingrid De Wolf; Christopher J. Wilson (Microelectron. Reliab., 2011)

Cu pumping in TSVs: Effect of pre-CMP thermal budget. - Ingrid De Wolf; Kris Croes; O. Varela Pedreira; Riet Labie; Augusto Redolfi; M. Van De Peer; Kris Vanstreels; C. Okoro; Bart Vandevelde; Eric Beyne (Microelectron. Reliab., 2011)

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures. - Biljana Dimcic; Riet Labie; Joke De Messemaeker; Kris Vanstreels; Kris Croes; Bert Verlinden; Ingrid De Wolf (Microelectron. Reliab., 2012)

TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes. - Arindam Mallik; Paul Zuber; Tsung-Te Liu; Bharani Chava; Bhavana Ballal; Pablo Royer Del Bario; Rogier Baert; Kris Croes; Julien Ryckaert; Mustafa Badaroglu; Abdelkarim Mercha; Diederik Verkest (DAC, 2013)

Design Technology co-optimization for N10. - Julien Ryckaert; Praveen Raghavan; Rogier Baert; Marie Garcia Bardon; Mircea Dusa; Arindam Mallik; Sushil Sakhare; Boris Vandewalle; Piet Wambacq; Bharani Chava; Kris Croes; Morin Dehan; et al. (CICC, 2014)

Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. - Yunlong Li; Stefaan Van Huylenbroeck; Els Van Besien; Xiaoping Shi; Chen Wu; Michele Stucchi; Gerald Beyer; Eric Beyne; Ingrid De Wolf; Kristof Croes (Microelectron. Reliab., 2014)

As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability. - Baojun Tang; Kris Croes; Yohan Barbarin; Yunqi Wang; Robin Degraeve; Yunlong Li; Maria Toledano-Luque; Thomas Kauerauf; Jürgen Bömmels; Zsolt Tökei; Ingrid De Wolf (Microelectron. Reliab., 2014)

Impact of process variability on BEOL TDDB lifetime model assessment. - Kris Croes; Deniz Kocaay; Ivan Ciofi; Jürgen Bömmels; Zsolt Tökei (IRPS, 2015)

Intrinsic reliability of local interconnects for N7 and beyond. - Kris Croes; Alicja Lesniewska; Chen Wu; Ivan Ciofi; Agnieszka Banczerowska; B. Briggs; S. Demuynck; Zsolt Tökei; Jürgen Bömmels; Yves Saad; W. Gao (IRPS, 2015)

Impact of oxide liner properties on TSV Cu pumping and TSV stress. - Joke De Messemaeker; O. Varela Pedreira; A. Moussa; Nabi Nabiollahi; Kris Vanstreels; Stefaan Van Huylenbroeck; Harold Philipsen; Patrick Verdonck; Bart Vandevelde; Ingrid De Wolf; Eric Beyne; Kris Croes (IRPS, 2015)

Constant voltage electromigration for advanced BEOL copper interconnects. - Baojun Tang; Kris Croes; Nicolas Jourdan 002; Jürgen Bömmels; Zsolt Tökei; Ingrid De Wolf; Eric Wilcox; Timothy McMullen (IRPS, 2015)

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. - Nabi Nabiollahi; Nele Moelans; Mario Gonzalez; Joke De Messemaeker; Christopher J. Wilson; Kristof Croes; Eric Beyne; Ingrid De Wolf (Microelectron. Reliab., 2015)

Reliability Challenges Related to TSV Integration and 3-D Stacking. - Kristof Croes; Joke De Messemaeker; Yunlong Li; Wei Guo; Olalla Varela Pedreira; Vladimir Cherman; Michele Stucchi; Ingrid De Wolf; Eric Beyne (IEEE Des. Test, 2016)

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. - Luka Kljucar; Mario Gonzalez; Ingrid De Wolf; Kristof Croes; Jürgen Bömmels; Zsolt Tökei (Microelectron. Reliab., 2016)

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. - Houman Zahedmanesh; Mario Gonzalez; Ivan Ciofi; Kristof Croes; Jürgen Bömmels; Zsolt Tökei (Microelectron. Reliab., 2016)

Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices. - Kristof J. P. Jacobs; T. Wang; Michele Stucchi; Mario Gonzalez; Kris Croes; Ingrid De Wolf; Eric Beyne (Microelectron. Reliab., 2017)

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. - Luka Kljucar; Mario Gonzalez; Kristof Croes; Ingrid De Wolf; Joke De Messemaeker; Gayle Murdoch; Philip Nolmans; Joeri De Vos; Jürgen Bömmels; Eric Beyne; Zsolt Tökei (Microelectron. Reliab., 2017)

LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration. - Deniz Kocaay; Philippe Roussel; Kris Croes; Ivan Ciofi; Yves Saad; Ingrid De Wolf (Microelectron. Reliab., 2017)

The first observation of p-type electromigration failure in full ruthenium interconnects. - Sofie Beyne; Shibesh Dutta; Olalla Varela Pedreira; Niels Bosman; Christoph Adelmann; Ingrid De Wolf; Zsolt Tökei; Kristof Croes (IRPS, 2018)

Stress mitigation of 3D-stacking/packaging induced stresses. - Kristof Croes; Vladimir Cherman; Melina Lofrano; Houman Zahedmanesh; Luka Kljucar; Mario Gonzalez; Ingrid De Wolf; Zsolt Tökei; Eric Beyne (IRPS, 2018)

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing. - Deniz Kocaay; Philippe Roussel; Kristof Croes; Ivan Ciofi; Alicja Lesniewska; Ingrid De Wolf (IRPS, 2018)

TSV process-induced MOS reliability degradation. - Yunlong Li; Michele Stucchi; Stefaan Van Huylenbroeck; Geert Van der Plas; Gerald Beyer; Eric Beyne; Kristof Croes (IRPS, 2018)

Insights into metal drift induced failure in MOL and BEOL. - Chen Wu; O. Varela Pedreira; Alicja Lesniewska; Yunlong Li; Ivan Ciofi; Zsolt Tökei; Kris Croes (IRPS, 2018)

Silicon Photonics for 56G NRZ Optical Interconnects. - Joris Van Campenhout; Yoojin Ban; Peter De Heyn; Ashwyn Srinivasan; Jeroen De Coster; Sebastien Lardenois; Brad Snyder; Sadhishkumar Balakrishnan; Guy Lepage; Negin Golshani; Sofie Janssen; Alicja Lesniewska; et al. (OFC, 2018)

SOT-MRAM 300MM Integration for Low Power and Ultrafast Embedded Memories. - Kevin Garello; Kevin Garello Yasin; S. Couet; Laurent Souriau; Johan Swerts; Sidharth Rao; Simon Van Beek; Wonsub Kim; Enlong Liu; Shreya Kundu; Diana Tsvetanova; Kris Croes; et al. (VLSI Circuits, 2018)

SOT-MRAM 300mm integration for low power and ultrafast embedded memories. - Kevin Garello; Farrukh Yasin; S. Couet; Laurent Souriau; Johan Swerts; Sidharth Rao; Simon Van Beek; Wonsub Kim; Enlong Liu; Shreya Kundu; Diana Tsvetanova; N. Jossart; et al. (CoRR, 2018)

Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. - Sofie Beyne; Olalla Varela Pedreira; Ingrid De Wolf; Zsolt Tökei; Kristof Croes (IRPS, 2019)

Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications. - Kris Croes; Veerle Simons; Sofie Beyne; Vladimir Cherman; Herman Oprins; Michele Stucchi; Philippe Absil; A. Glabman; Eric Wilcox (IRPS, 2019)

New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis. - Norbert Herfurth; Anne Beyreuther; Elham Amini; Christian Boit; Michél Simon-Najasek; Susanne Hübner; Frank Altmann; R. Herfurth; Chen Wu; Ingrid De Wolf; Kris Croes (IRPS, 2019)

Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors. - Alicja Lesniewska; S. A. Srinivasan; Joris Van Campenhout; Barry J. O'Sullivan; Kris Croes (IRPS, 2019)

Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects. - Sarath Mohanachandran Nair; Rajendra Bishnoi; Mehdi Baradaran Tahoori; Houman Zahedmanesh; Kristof Croes; Kevin Garello; Gouri Sankar Kar; Francky Catthoor (IRPS, 2019)

Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects. - Chen Wu; Adrian Vaisman Chasin; Andrea Padovani; Alicja Lesniewska; Steven Demuynck; Kris Croes (IRPS, 2019)

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. - Alicja Lesniewska; Philippe J. Roussel; Davide Tierno; Victor Vega-Gonzalez; Marleen H. van der Veen; Patrick Verdonck; Nicolas Jourdan 002; Christopher J. Wilson; Zsolt Tökei; Kris Croes (IRPS, 2020)

Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects. - Sarath Mohanachandran Nair; Rajendra Bishnoi; Mehdi B. Tahoori; Houman Zahedmanesh; Kristof Croes; Kevin Garello; Gouri Sankar Kar; Francky Catthoor (IRPS, 2020)

Metal reliability mechanisms in Ruthenium interconnects. - Olalla Varela Pedreira; Michele Stucchi; Anshul Gupta; Victor Vega-Gonzalez; Marleen van der Veen; Stephane Lariviere; Christopher J. Wilson; Zsolt Tökei; Kristof Croes (IRPS, 2020)

Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects. - Chen Wu; Adrian Vaisman Chasin; Steven Demuynck; Naoto Horiguchi; Kris Croes (IRPS, 2020)

Electrical and Optical Reliability Analysis of GeSi Electro-Absorption Modulators. - Artemisia Tsiara; S. A. Srinivasan; S. Balakrishnan 002; Marianna Pantouvaki; Philippe Absil; Joris Van Campenhout; Kris Croes (OFC, 2020)

Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper. - Jacopo Franco; Hiroaki Arimura; J.-F. de Marneffe; A. Vandooren; L.-Å. Ragnarsson; Zhicheng Wu; Dieter Claes; E. Dentoni Litta; N. Horiguchi; Kris Croes; Dimitri Linten; Tibor Grasser; et al. (ICICDT, 2021)

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. - Alicja Lesniewska; Olalla Varela Pedreira; Melina Lofrano; Gayle Murdoch; Marleen H. van der Veen; Anish Dangol; Naoto Horiguchi; Zsolt Tökei; Kris Croes (IRPS, 2021)

Reliability of Mo as Word Line Metal in 3D NAND. - Davide Tierno; Kristof Croes; Arjun Ajaykumar; Siva Ramesh; Geert Van den Bosch; Maarten Rosmeulen (IRPS, 2021)

Electromigration limits of copper nano-interconnects. - Houman Zahedmanesh; Olalla Varela Pedreira; Zsolt Tokei; Kristof Croes (IRPS, 2021)

A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network. - Houman Zahedmanesh; Ivan Ciofi; Odysseas Zografos; Mustafa Badaroglu; Kristof Croes (SLIP, 2021)

Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism. - Lin Hou; Emmanuel Chery; Kristof Croes; Davide Tierno; Soon Aik Chew; Yangyin Chen; Peter Rakbin; Eric Beyne (IRPS, 2022)

Assessment of critical Co electromigration parameters. - O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; Philippe J. Roussel; Marleen H. van der Veen; Veerle Simons; Emmanuel Chery; Ivan Ciofi; Kris Croes (IRPS, 2022)

Degradation mechanisms in Germanium Electro-Absorption Modulators. - Artemisia Tsiara; Alicja Lesniewska; Philippe Roussel; Srinivasan Ashwyn Srinivasan; Mathias Berciano; Marko Simicic; Marianna Pantouvaki; Joris Van Campenhout; Kristof Croes (IRPS, 2022)

System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents. - Houman Zahedmanesh; Ivan Ciofi; Odysseas Zografos; Kristof Croes; Mustafa Badaroglu (IRPS, 2022)

Analyzing the Electromigration Challenges of Computation in Resistive Memories. - Mahta Mayahinia; Mehdi B. Tahoori; Manu Perumkunnil; Kristof Croes; Francky Catthoor (ITC, 2022)

Degradation mechanisms and lifetime assessment of Ge Vertical PIN photodetectors. - Kristof Croes; Veerle Simons; Brecht Truijen; Philippe Roussel; Koen Van Sever; Artemisia Tsiara; Jacopo Franco; Philippe Absil (OFC, 2022)

Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM. - Mahta Mayahinia; Mehdi B. Tahoori; Manu Perumkunnil Komalan; Houman Zahedmanesh; Kristof Croes; Tommaso Marinelli; José Ignacio Gómez Pérez; Timon Evenblij; Gouri Sankar Kar; Francky Catthoor (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022)

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. - Youqi Ding; O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; T. Chavez; Hosain Farr; Ingrid De Wolf; Kris Croes (IRPS, 2023)

Towards accurate temperature prediction in BEOL for reliability assessment (Invited). - Melina Lofrano; Herman Oprins; Xinyue Chang; Bjorn Vermeersch; Olalla Varela Pedreira; Alicja Lesniewska; Vladimir Cherman; Ivan Ciofi; Kristof Croes; Seongho Park; Zsolt Tokei (IRPS, 2023)

Impact of via geometry and line extension on via-electromigration in nano-interconnects. - Ahmed Sobhi Saleh; Houman Zahedmanesh; Hajdin Ceric; Ingrid De Wolf; Kris Croes (IRPS, 2023)

A pragmatic network-aware paradigm for system-level electromigration predictions at scale. - Houman Zahedmanesh; Philippe Roussel; Ivan Ciofi; Kristof Croes (IRPS, 2023)

Challenges for Interconnect Reliability: From Element to System Level. - Olalla Varela Pedreira; Houman Zahedmanesh; Youqi Ding; Ivan Ciofi; Kristof Croes (ISPD, 2023)

Novel Low Thermal Budget CMOS RMG: Performance and Reliability Benchmark Against Conventional High Thermal Budget Gate Stack Solutions. - Jacopo Franco; Hiroaki Arimura; J.-F. de Marneffe; S. Brus; Romain Ritzenthaler; E. Dentoni Litta; Kris Croes; Ben Kaczer; N. Horiguchi (VLSI Technology and Circuits, 2023)

BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure. - Y. Fang; Alicja Lesniewska; Ivan Ciofi; Philippe Roussel; Chen Wu; Victor Vega-Gonzalez; Ingrid De Wolf; Kris Croes (IRPS, 2024)

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. - O. Varela Pedreira; Youqi Ding; D. Coenen; Philippe Roussel; Ahmed Sobhi Saleh; Veerle Simons; Houman Zahedmanesh; Ivan Ciofi; Kris Croes (IRPS, 2024)

32×100 GHz WDM filter based on ultra-compact silicon rings with a high thermal tuning efficiency of 5.85 mW/π. - Qingzhong Deng; Ahmed H. El-Saeed; Alaa Elshazly; Guy Lepage; Chiara Marchese; Hakim Kobbi; Rafal Magdziak; Jeroen De Coster; Neha Singh; Marko Ersek Filipcic; Kristof Croes; Dimitrios Velenis; et al. (OFC, 2024)

Local Electric Field-Aware 3D TDDB Model for BEOL Reliability Predictions. - Y. Fang; Alicja Lesniewska; Ivan Ciofi; Philippe Roussel; I. De Wolf; Kris Croes (IRPS, 2025)

Impact of Al-doping on Al: HfO2Dielectric Reliability in MIM Capacitors. - C. Fohn; F. Zharfan; Emmanuel Chery; Kris Croes; Michele Stucchi; V. Afanas'ev (IRPS, 2025)

Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps. - Alicja Lesniewska; Y. Fang; G. Delie; Philippe Roussel; Koen Van Sever; Emmanuel Chery; O. Varela Pedreira; Ivan Ciofi; S. H. Park; Zsolt Tokei; Kris Croes (IRPS, 2025)

Novel Concept-Oriented Synthetic Data approach for Training Generative AI-Driven Crystal Grain Analysis Using Diffusion Model. - Ahmed Sobhi Saleh; Kristof Croes; Hajdin Ceric; Ingrid De Wolf; Houman Zahedmanesh (CoRR, 2025)