MTF test system with AC based dynamic joule correction for electromigration tests on interconnects. - Leen Biesemans; K. Schepers; Kris Vanstreels; Jan D'Haen; Ward De Ceuninck; Marc D'Olieslaeger (Microelectron. Reliab., 2004)

A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure. - Kris Vanstreels; Marc D'Olieslaeger; Ward De Ceuninck; Jan D'Haen; Karen Maex (Microelectron. Reliab., 2005)

Cu pumping in TSVs: Effect of pre-CMP thermal budget. - Ingrid De Wolf; Kris Croes; O. Varela Pedreira; Riet Labie; Augusto Redolfi; M. Van De Peer; Kris Vanstreels; C. Okoro; Bart Vandevelde; Eric Beyne (Microelectron. Reliab., 2011)

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures. - Biljana Dimcic; Riet Labie; Joke De Messemaeker; Kris Vanstreels; Kris Croes; Bert Verlinden; Ingrid De Wolf (Microelectron. Reliab., 2012)

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. - Andrej Ivankovic; Kris Vanstreels; Daniel Vanderstraeten; Guy Brizar; Renaud Gillon; Eddy Blansaer; Bart Vandevelde (Microelectron. Reliab., 2012)

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. - Bart Vandevelde; Andrej Ivankovic; B. Debecker; Melina Lofrano; Kris Vanstreels; Wei Guo; Vladimir Cherman; Marcel Gonzalez; Geert Van der Plas; Ingrid De Wolf; Eric Beyne; Zsolt Tokei (Microelectron. Reliab., 2014)

Soft, Comfortable Polymer Dry Electrodes for High Quality ECG and EEG Recording. - Yun-Hsuan Chen; Maaike Op de Beeck; Luc Vanderheyden; Evelien Carrette; Vojkan Mihajlovic; Kris Vanstreels; Bernard Grundlehner; Stefanie Gadeyne; Paul Boon 001; Chris Van Hoof (Sensors, 2014)

Impact of oxide liner properties on TSV Cu pumping and TSV stress. - Joke De Messemaeker; O. Varela Pedreira; A. Moussa; Nabi Nabiollahi; Kris Vanstreels; Stefaan Van Huylenbroeck; Harold Philipsen; Patrick Verdonck; Bart Vandevelde; Ingrid De Wolf; Eric Beyne; Kris Croes (IRPS, 2015)