Effect of gate resistance on high-frequency power switching efficiencies of advanced power MOSFETs. - Krishna Shenai (IEEE J. Solid State Circuits, 1990)

Design considerations of IGBT's in resonant converter applications. - Hsin-hua Li; Nasser H. Kutkut; Deepakraj Divan; Krishna Shenai (IEEE J. Solid State Circuits, 1996)

Novel Design for Testability of a Mixed-Signal VLSI IC. - Erik A. McShane; Krishna Shenai; Leon Alkalai; E. Kolawa; Victor Boyadzhyan; Brent R. Blaes; Wai-Chi Fang (Great Lakes Symposium on VLSI, 1999)

Monolithic Microprocessor and RF Transceiver in 0.25-micron FDSOI CMOS. - Erik A. McShane; Krishna Shenai; Leon Alkalai; E. Kolawa; Victor Boyadzhyan; Brent R. Blaes; Wai-Chi Fang (Great Lakes Symposium on VLSI, 1999)

Microelectronics Packaging. - Pankaj Khandelwal; Krishna Shenai (The VLSI Handbook, 1999)

VLSI Technology. - Krishna Shenai; Erik A. McShane (The VLSI Handbook, 1999)

Correct-by-Design CAD Enhancement for EMI Signal Integrity. - Erik A. McShane; Krishna Shenai (ISQED, 2000)

An improved approach to application-specific power electronics education. Curriculum development. - Erik A. McShane; Malay Trivedi; Krishna Shenai (IEEE Trans. Educ., 2001)

An improved approach to application-specific power electronics education-switch characterization and modeling. - Malay Trivedi; Erik A. McShane; Ramachandran Vijayalakshmi; Amit Mulay; Siamak Abedinpour; Steve Atkinson; Krishna Shenai (IEEE Trans. Educ., 2002)

Cognitive Distributed Networks in Environmental e-Science. - Ramesh Bharadwaj; Supratik Mukhopadhyay; Manuel Peralta; Krishna Shenai; Subhashis Majumder (FTDCS, 2008)

The Perfect Power semiconductor Switch for 21st Century Global Energy Economy. - Krishna Shenai (J. Circuits Syst. Comput., 2013)

Rugged Electrical Power Switching in Semiconductors: A Systems Approach. - Krishna Shenai; Michael Dudley; Robert F. Davis (Proc. IEEE, 2014)

High-Density Power Conversion and Wide-Bandgap Semiconductor Power Electronics Switching Devices. - Krishna Shenai (Proc. IEEE, 2019)

Scanning the Issue. - Bing Zhang 001; Y. Zeng; Q. Wu; R. Zhang; A. B. Magoun; Zhengchao Chen; Dailiang Peng; Jón Atli Benediktsson; Bo Liu 020; Lei Zou 002; Jun Li 009; Antonio J. Plaza; et al. (Proc. IEEE, 2019)