Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform. - Krishna T. Settaluri; Sen Lin 002; Sajjad Moazeni; Erman Timurdogan; Chen Sun 003; Michele Moresco; Zhan Su 001; Yu-Hsin Chen; Gerald Leake; Douglas LaTulipe; Colin McDonough; Jeremiah Hebding; et al. (ESSCIRC, 2015)

An ultra low power 3D integrated intra-chip silicon electronic-photonic link. - Erman Timurdogan; Zhan Su 001; Krishna T. Settaluri; Sen Lin 002; Sajjad Moazeni; Chen Sun 003; Gerald Leake; Douglas D. Coolbaugh; Benjamin R. Moss; Michele Moresco; Vladimir Stojanovic; Michael R. Watts (OFC, 2015)

First Principles Optimization of Opto-Electronic Communication Links. - Krishna T. Settaluri; Christopher Lalau-Keraly; Eli Yablonovitch; Vladimir Stojanovic (IEEE Trans. Circuits Syst. I Regul. Pap., 2017)