Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules. - Kristian Bonderup Pedersen; Peter Kjær Kristensen; Vladimir N. Popok; Kjeld Pedersen (Microelectron. Reliab., 2013)

Effects of thermal cycling on aluminum metallization of power diodes. - Mads Brincker; Kristian Bonderup Pedersen; Peter Kjær Kristensen; Vladimir N. Popok (Microelectron. Reliab., 2015)

Ageing monitoring in IGBT module under sinusoidal loading. - Pramod Ghimire; Kristian Bonderup Pedersen; Bjørn Rannestad; Stig Munk-Nielsen (Microelectron. Reliab., 2015)

Degradation mapping in high power IGBT modules using four-point probing. - Kristian Bonderup Pedersen; Lotte Haxen Østergaard; Pramod Ghimire; Vladimir N. Popok; Kjeld Pedersen (Microelectron. Reliab., 2015)

Mechanisms of metallization degradation in high power diodes. - Mads Brincker; Peter Kjær Kristensen; Kristian Bonderup Pedersen; Vladimir N. Popok (Microelectron. Reliab., 2016)

Comprehensive physical analysis of bond wire interfaces in power modules. - Vladimir N. Popok; Kristian Bonderup Pedersen; Peter Kjær Kristensen; Kjeld Pedersen (Microelectron. Reliab., 2016)

Wire bond degradation under thermo- and pure mechanical loading. - Kristian Bonderup Pedersen; Dennis A. Nielsen; Bernhard Czerny; Golta Khatibi; Francesco Iannuzzo; Vladimir N. Popok; Kjeld Pedersen (Microelectron. Reliab., 2017)